Electrostatic discharge (ESD) shielding is the process of limiting electric current that flows when an excess of electric charge, stored on an electrically insulated object, finds a path to an object at a different electrical potential (such as ground) by separating them with a barrier made of a lightly conductive material. Static dissipative materials have electrical resistance between insulative and conductive materials. There can be electron flow across or through the dissipative material, but it is controlled by the surface resistance or volume resistance of the material.

Typical materials for ESD shielding in the semiconductor and medical device industries include carbon-filled silicone and polyurethane blends that shield highly sensitive electronic circuitry.

Electromagnetic interference (EMI) shielding is the process of blocking the induction of electromagnetic radiation, which is emitted by electrical circuits carrying rapidly changing signals, as a by-product of their normal operation to other circuits which causes unwanted signals (interference or noise). This is achieved by separating the circuits with a barrier made of conductive material.

Semiconductor Protection Includes: semiconductor testing, robotic interfaces, chip handling, circuit shielding, and test equipment packaging.

In short both methods protect electronic components from the impact of the acid produced through ozone composition.